Nyob rau hauv lub ceramic Circuit Board ua thiab ntau lawm txheej txheem, laser ua mas muaj xws li laser drilling thiab laser txiav.
Cov ntaub ntawv ceramic xws li alumina thiab txhuas nitride muaj qhov zoo ntawm cov thermal conductivity, siab rwb thaiv tsev thiab kub tsis kam, thiab muaj ntau yam kev siv hauv cov khoom siv hluav taws xob thiab semiconductors. Txawm li cas los xij, cov ntaub ntawv ceramic muaj siab hardness thiab brittleness, thiab nws cov molding ua nyuaj heev, tshwj xeeb tshaj yog cov ua ntawm micropores. Vim lub zog ceev ceev thiab zoo directivity ntawm lub laser, lasers feem ntau yog siv los perforate ceramic daim hlau. Laser ceramic perforation feem ntau siv cov lasers los yog quasi-nruam lasers (fiber lasers). Lub laser beam yog teem rau ntawm lub workpiece muab tso rau perpendicular mus rau lub laser axis, ib tug laser beam nrog lub zog ceev ceev (10 * 5-10 * 9w / cm * 2) yog emitted rau yaj thiab vaporize cov khoom, thiab ib tug airflow coaxial nrog. lub nqaj yog ejected los ntawm laser txiav lub taub hau. Cov khoom molten yog tshuab tawm hauv qab ntawm qhov incision kom maj mam tsim ib lub qhov.
Vim yog qhov me me thiab qhov ntom ntom ntawm cov khoom siv hluav taws xob thiab cov khoom siv hluav taws xob semiconductor, qhov precision thiab ceev ntawm laser drilling yuav tsum tau siab. Raws li cov kev xav tau sib txawv ntawm kev siv cov khoom siv, cov khoom siv hluav taws xob thiab cov khoom siv hluav taws xob semiconductor muaj qhov me me thiab qhov ntom ntom. Vim nws cov yam ntxwv, qhov precision thiab ceev ntawm laser drilling yuav tsum siab. Raws li cov kev cai sib txawv ntawm kev siv cov khoom siv, txoj kab uas hla ntawm micro-qhov yog nyob rau hauv thaj tsam ntawm 0.05 txog 0.2 hli. Rau cov lasers siv rau ceramic precision ua, feem ntau lub focal chaw txoj kab uas hla ntawm lub laser yog tsawg dua los yog sib npaug rau 0.05mm. Nyob ntawm qhov tuab thiab qhov loj ntawm cov phaj ceramic, nws feem ntau tuaj yeem tswj tau qhov defocus kom ua tiav los ntawm qhov xuas nrig ntaus ntawm qhov sib txawv apertures. Rau qhov los ntawm qhov uas muaj txoj kab uas hla tsawg dua 0.15mm, Punching tuaj yeem ua tiav los ntawm kev tswj tus nqi defocus.
Feem ntau muaj ob hom ceramic Circuit Board txiav: waterjet txiav thiab laser txiav. Tam sim no, fiber ntau lasers feem ntau yog siv rau laser txiav ntawm lub khw.
Fiber laser txiav ceramic circuit boards muaj cov hauv qab no zoo:
(1)High precision, ceev ceev, nqaim txiav seam, me me tshav kub cuam tshuam cheeb tsam, du txiav nto tsis muaj burrs.
(2) Lub laser txiav lub taub hau yuav tsis kov qhov chaw ntawm cov khoom thiab yuav tsis khawb lub workpiece.
(3)Lub slit yog nqaim, thaj tsam ntawm tshav kub yog me me, lub zos deformation ntawm lub workpiece yog heev me me, thiab tsis muaj mechanical deformation.
(4)Kev ua haujlwm yooj yim yog qhov zoo, nws tuaj yeem ua cov duab kos duab, thiab nws tuaj yeem txiav cov kav dej thiab lwm yam khoom tshwj xeeb.
Nrog kev txhim kho txuas ntxiv ntawm 5G kev tsim kho, kev lag luam kev lag luam xws li precision microelectronics thiab aviation thiab nkoj tau tsim ntxiv, thiab cov teb no npog daim ntawv thov ntawm ceramic substrates. Ntawm lawv, ceramic substrate PCB tau maj mam tau txais ntau thiab ntau daim ntawv thov vim nws cov kev ua tau zoo tshaj.
Ceramic substrate yog cov khoom siv tseem ceeb ntawm cov hluav taws xob hluav taws xob hluav taws xob hluav taws xob hluav taws xob hluav taws xob thiab kev siv tshuab sib txuas, nrog cov qauv compact thiab qee qhov brittleness. Nyob rau hauv txoj kev ua ib txwm ua, muaj kev ntxhov siab thaum lub sij hawm ua, thiab nws yog ib qho yooj yim los tsim cov kab nrib pleb rau cov ntawv nyias nyias.
Nyob rau hauv txoj kev loj hlob ntawm lub teeb thiab nyias, miniaturization, thiab lwm yam., cov tsoos txiav txheej txheem tsis tau raws li qhov kev thov vim qhov tsis txaus precision. Laser yog ib qho khoom siv tsis sib cuag, uas muaj qhov zoo tshaj plaws ntawm kev ua cov txheej txheem hauv kev txiav, thiab ua lub luag haujlwm tseem ceeb hauv kev ua cov txheej txheem ceramic substrate PCB.
Nrog rau kev txhim kho txuas ntxiv ntawm kev lag luam microelectronics, cov khoom siv hluav taws xob tau maj mam txhim kho nyob rau hauv cov kev taw qhia ntawm miniaturization, lightness thiab thinning, thiab cov kev xav tau ntawm precision tau nce siab dua. Qhov no yog khi rau muab cov kev xav tau siab dua thiab siab dua ntawm kev ua tiav qib ntawm ceramic substrates. Los ntawm txoj kev xav ntawm txoj kev loj hlob, daim ntawv thov ntawm laser ua ceramic substrate PCB muaj kev loj hlob zeem muag!
